I.E. Anderson, J. C. Foley, B.A. Cook, J. Harringa, R.L. Terpstra and O. Unal, “Alloying Effects in Near-Eutectic Sn-Ag-Cu Solder Alloys for Improved Microstructural Stability,” Journal of Electronic Materials, Vol. 30, No. 9, 2001, pp. 1050-1059. doi:10.1007/s11664-001-0129-5

has been cited by the following article:

• TITLE: A Top-Down Approach of Making Sn-3.5Ag Nanosolder Alloy by Swirl Method

  AUTHORS: Hsin Jen Pan, Chao Yang Lin, Jung Hua Chou, Udit Surya Mohanty, Yuan Gee Lee

  KEYWORDS: Swirl Flow, Particle Size Distribution, Nanoparticle Aggregation

  JOURNAL NAME: Materials Sciences and Applications, Vol.2 No.9, September 20, 2011

  ABSTRACT: The nanoparticles of tin-silver solder, Sn-3.5Ag, of necklace geometry were made in a swirl batch. It was found that the addition of the element, Ag, did not vary the microstructure of the solder matrix, but Ag simply diluted into the Sn matrix randomly. The swirl flow facilitated the formation of particles with different sizes. It was found that the size distribution of the nanoparticles was strongly related to the height in the swirl batch. In addition, the aggregation of the nanoparticles was explored and the dispersion of the nanoparticles was achieved by adjusting the pH value of the solution near the neutral value.