Article citationsMore>>

Zhou, Z. and Wang, X. (2011) Analysis of Squeeze-Film Air Damping of Thick Perforated Plate in MEMS Device. Proceedings of the 6th IEEE International Conference on Nana/Micro Engineering and Molecular Systems, Kaohsiung, 20-23 February 2011, 131-133.
https://doi.org/10.1109/nems.2011.6017312

has been cited by the following article:

Follow SCIRP
Twitter Facebook Linkedin Weibo
Contact us
+1 323-425-8868
customer@scirp.org
WhatsApp +86 18163351462(WhatsApp)
Click here to send a message to me 1655362766
Paper Publishing WeChat
Free SCIRP Newsletters
Copyright © 2006-2024 Scientific Research Publishing Inc. All Rights Reserved.
Top