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Kim, S. and Kim, H.-J. (2003) Curing Behavior and Viscoelastic Properties of Pine and Wattle Tannin-Based Adhesives Studied by Dynamic Mechanical Thermal Analysis and FT-IR-ATR Spectroscopy. Journal of Adhesion Science and Technology, 17, 1369-1383.
http://dx.doi.org/10.1163/156856103769172797

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