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W.-H. Kuan and C.-Y. Hu, “Chemicals Evidences for the Optimal Coagulant Dosage and pH Adjustment of Silica Removal from Chemical Mechanical Polishing (CMP) Wastewater,” Colloids and Surfaces A: Physicochemical and Engineering Aspects, Vol. 342, 2009, pp. 1-7.
http://dx.doi.org/10.1016/j.colsurfa.2009.03.019

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