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https://doi.org/10.1007/s11814-010-0350-0

has been cited by the following article:

• TITLE: Study of Dielectric and Thermal Conductivity Characteristics of Polyimide Composite

  AUTHORS: Meehye Oh, Yeoseong Yoon, Eunjin Jang, Dongjoon Moon

  KEYWORDS: Dielectric Property, Thermal Conductivity, Polyimide Composite, Flexible PCB

  JOURNAL NAME: Materials Sciences and Applications, Vol.10 No.3, March 12, 2019

  ABSTRACT: The graphene is used to enhance the thermal conductivity, but it is difficult to obtain uniform dispersion and low dielectric property. We fabricate the polyimide composite with high thermal conductivity and low dielectric property. It changes the filler contents, and examines curing time and dispersion. The dispersion characteristics were quantified by absorbance measurement. The graphene 0.1 wt% and BN 0.5 wt% polyimide composites show a thermal conductivity of 6.6 W/m®K by LFA (Laser Flash Analysis) and a dielectric constant of 4.6@10 GHz by SPDR (Split Post Dielectric Resonators).