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Wang, Y., Wu, Y., Uuo, H.G., Fujimoto, M., Nomura, M. and Shimada, K. (2015) A New Magnetic Compound Fluid Slurry and Its Performance in Magnetic Field-Assisted Polishing of Oxygen-Free Copper. Journal of Applied Physics, 117, Article ID: 17D712.
http://dx.doi.org/10.1063/1.4914058

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