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Schaefer, M., Fourelle, R.A. and Liang, J. (1998) Theory of Intermetallic Phase Growth between Cu and Liquid Sn-Pb Solder Based on Grain Boundary Diffusion Control. Journal of Electronic Materials, 27, 1167-1176.
http://dx.doi.org/10.1007/s11664-998-0066-7

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