Vandamme, E.P., Schreurs, D.M.M.-P. and Dinther, C.V. (2001) Improved Three-Step De-Embedding Method to Accurately Account for the Influence of Pad Parasitics in Silicon On-Wafer RF Test-Structures. IEEE Transactions on Electron Devices, 737-741. http://dx.doi.org/10.1109/16.915712

has been cited by the following article:

• TITLE: Automated Calibration of RF On-Wafer Probing and Evaluation of Probe Misalignment Effects Using a Desktop Micro-Factory

  AUTHORS: F. T. von Kleist-Retzow, T. Tiemerding, P. Elfert, O. C. Haenssler

  KEYWORDS: Calibration, On-Wafer Measurements, Misalignment, Automation, High Frequency (HF) Probe, Ground-Signal-Ground (GSG) Probe

  JOURNAL NAME: Journal of Computer and Communications, Vol.4 No.3, March 2, 2016

  ABSTRACT: A fully automatic setup for on-wafer contact probing will be presented. This setup consists of six automatable nano positioning axes used as tool holder and a sample holder. With this setup a fully automatic one-port SOL calibration for a Vector Network Analyzer is done. Furthermore a fully automated on-wafer contact probing is performed. Afterwards, the effects of a misalignment of the three tips of a GSG-probe are examined. Additionally the error on the calibration is calculated to determine its effect on the measurement. The results show, that a misalignment of the probe has a high impact on the measurement of the VNA. Hence a fully automated on-wafer probing presented in this paper is a good way to detect these misalignments and correct them if necessary.