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http://dx.doi.org/10.1021/nl5009713

has been cited by the following article:

• TITLE: Electrodeposition of Gold to Conformally Fill High-Aspect-Ratio Nanometric Silicon Grating Trenches: A Comparison of Pulsed and Direct Current Protocols

  AUTHORS: Sami Znati, Nicholas Chedid, Houxun Miao, Lei Chen, Eric E. Bennett, Han Wen

  KEYWORDS: Pulsed Electroplating, Gold Electroplating, High Aspect Ratio Trenches, Gold Electrodepostion, Di-rect Current Electrodeposition, Pulsed vs. Direct Current Electroplating, Atomic Layer Deposition Platinum Seed Layer, Silicon Trench Gratings, Trench Filling, Grating Filling, ALD Adhesive Layer

  JOURNAL NAME: Journal of Surface Engineered Materials and Advanced Technology, Vol.5 No.4, October 16, 2015

  ABSTRACT: Filling high-aspect-ratio trenches with gold is a frequent requirement in the fabrication of X-ray optics as well as micro-electronic components and other fabrication processes. Conformal electrodeposition of gold in sub-micron-width silicon trenches with an aspect ratio greater than 35 over a grating area of several square centimeters is challenging and has not been described in the literature previously. A comparison of pulsed plating and constant current plating led to a gold electroplating protocol that reliably filled trenches for such structures.