Zhao, G.J., Sheng, G.M., Wu, L.L. and Yuan, Z.J. (2012) Interfacial Characteristics and Microstructureal Evolution of Sn-6.5Zn Solder/Cu Substrate Joints during Aging. Transactions of Nonferrous Metals Society of China, 22, 1954-1960.
http://dx.doi.org/10.1016/S1003-6326(11)61413-1

has been cited by the following article:

• TITLE: Effect of Bismuth Addition on Structure and Mechanical Properties of Tin-9Zinc Soldering Alloy

  AUTHORS: Muhommad Abdul Wadud, M. A. Gafur, Md. Rakibul Qadir, Mohammad Obaidur Rahman

  KEYWORDS: Lead Free Solder Alloy, Eutectic Alloy, Microhardness

  JOURNAL NAME: Materials Sciences and Applications, Vol.6 No.9, September 16, 2015

  ABSTRACT: Sn-Zn based solder is a possible replacement of Pb solder because of its better mechanical properties. The alloys need to be studied and explored to get a usable solder alloy having better properties. In this work eutectic Sn-9Zn and three Tin-Zinc-Bismuth ternary alloys were prepared and investigated their microhardness and mechanical properties. Microhardness, tensile strength and elastic modulus increase with Bi addition while ductility decreases with Bi addition.