•   Home
  • Proceedings
  • International Conference on Information, Electronic and Comp...

International Conference on Information, Electronic and Computer Science (ICIECS 2010 E-BOOK)

Zibo,China,11.26-11.28,2010

ISBN: 978-1-935068-42-6 Scientific Research Publishing, USA

E-Book 2224pp Pub. Date: November 2010

Category: Computer Science & Communications

Price: $360

Title: Research on Anti-seepage Characteristics of Composite Liner and its Application in Sanitary Landfill Engineering
Source: International Conference on Information, Electronic and Computer Science (ICIECS 2010 E-BOOK) (pp 1918-1922)
Author(s): Xiaobo Xiong, School of Architecture and Civil Engineering, Nantong University, Nantong, China, 226019 ;Key Laboratory of Geotechnical and Underground Engineering, Tongji University, Shanghai, China, 200092
Abstract: The method of sanitary landfill is the main the primary disposal means of municipal solid waste in our country at this stage, while rainfall and urban waste decomposition will produce a large number of leachate, which makes the structural design of impervious layer is crucial to ensure that the landfill not around environmental cause secondary pollution. At present, the geotextile Geosynthetic Clay Liners (GCL) and high-density polyethylene membrane pad lining(HDPE) is increasingly being applied to the city landfill anti-seepage engineering. Based on the liner of landfill materials, basic structural design, leachate generation and migration volume calculation, etc. described. And based on practical project to establish a mathematical model of leachate migration, finite difference method and rely on MATLAB7.0 software platform for programming analysis revealed the leachate migration law, all above maybe have some reference value for the future landfill design and construction
Proceedings by Subjects
Resources
Products
Contact us
book@scirp.org
WhatsApp +86 18163351462(WhatsApp)
Click here to send a message to me 1243940697
Book Publishing WeChat
Follow SCIRP
Free SCIRP Newsletters
Copyright © 2006-2024 Scientific Research Publishing Inc. All Rights Reserved.
Top