Journal of Materials Science and Chemical Engineering

Volume 7, Issue 10 (October 2019)

ISSN Print: 2327-6045   ISSN Online: 2327-6053

Google-based Impact Factor: 0.72  Citations  

The Microstructure and Properties of Copper with Ceria Nanoparticles Addition

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DOI: 10.4236/msce.2019.710004    388 Downloads   1,182 Views  Citations

ABSTRACT

Copper-based composites strengthened by ceria nanoparticles were processed by conventional powder metallurgy: mixing (30 min and 46 rpm), compaction (cold, uniaxial, 1080 MPa for 10 s) and sintering (800°C for 6 h in vacuum atmosphere of 105 torr). It was studied the microstructure (optical microscopy, scanning electron microscopy), X-ray diffraction with Rietveld refinement and some properties (electrical conductivity, Vickers hardness and fracture analysis) of the compositions 92 wt% Cu - 8 wt% CeO2 and 80 wt% Cu - 20 wt% CeO2. The results showed uniform phase distribution, low porosity and ceria disperse inside copper grain. In despite of properties, the composites had electrical conductivity of 38% IACS and 15% IACS and hardness of 69 and 88 HV5, respectively. The results of 92 wt% Cu - 8 wt% CeO2 composites were promising, and they are in according with actual literature.

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da Fonseca, D. and Monteiro, W. (2019) The Microstructure and Properties of Copper with Ceria Nanoparticles Addition. Journal of Materials Science and Chemical Engineering, 7, 40-48. doi: 10.4236/msce.2019.710004.

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