Author(s)

Abass Ali Saleh

Department of Materials Engineering, College of Engineering, Mustansiriyah University, Baghdad, Iraq.

The major awkwardness when joining AA2014 lies in the presence of creation of oxide films and brittle intermetallic in the bond region. However, diffusion bonding can be used to join these alloys without much difficulty. This paper reveals the characterization of diffusion connection of aluminum alloy AA 2014 with and without applying copper powder. Joining was achieved in vacuum up to (1 × 10^-5 mbar) by means of vacuum system. Aluminum alloy AA2014 samples were done as cylinder form and interlayer thickness was equal 100 μm, under joining conditions of (325°C - 475°C) and 4 MPa and period of (1 hour). The ultimate strength was found equal to 188.36 MPa. Bonding joint was examined using light microscope, (SEM) with (EDS) for determining microstructure and depth of diffusion and microhardness was also used at connection zone. XRD outcomes display that the main intermetallic compound phase formula was Al₂C. The maximum depth of diffusion obtained was 19.1 μm.

2014 AA Alloys, Diffusion Bonding, Microstructure

Saleh, A. (2019) Microstructure and Strength of Diffusion Bonded 2014 AA Alloys Using Copper Interlayer. Open Journal of Applied Sciences, 9, 342-353. doi: 10.4236/ojapps.2019.95028.