Thermal Simulation for Two-Phase Liquid Cooling 3D-ICs - Journal of Computer and Communications

JCC > Vol.4 No.15, November 2016

Journal of Computer and Communications

Volume 4, Issue 15 (November 2016)

ISSN Print: 2327-5219 ISSN Online: 2327-5227

Google-based Impact Factor: 1.12 Citations

Thermal Simulation for Two-Phase Liquid Cooling 3D-ICs ()

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Download as PDF (Size: 2031KB) PP. 33-45

DOI: 10.4236/jcc.2016.415003 1,304 Downloads 2,842 Views Citations

Author(s)

Hong-Wen Chiou^1,2, Yu-Min Lee¹

Affiliation(s)

¹Department of Electrical and Computer Engineering, National Chiao Tung University, Hsinchu, Chinese Taipei.
²Industrial Technology Research Institute, Hsinchu, Chinese Taipei.

ABSTRACT

This work presents an algorithm for simulating more accurate temperature distribution in two-phase liquid cooling for three-dimensional integrated circuits than the state of-the-art methods by utilizing local multi-linear interpolation techniques on heat transfer coefficients between the microchannel and silicon substrate, and considering the interdependence between the thermal conductivity of silicon and temperature values. The experimental results show that the maximum and average errors are only 9.7% and 6.7% compared with the measurements, respectively.

KEYWORDS

Thermal Simulation, Microchannel, Two-Phase Liquid Cooling

Share and Cite:

Chiou, H. and Lee, Y. (2016) Thermal Simulation for Two-Phase Liquid Cooling 3D-ICs. Journal of Computer and Communications, 4, 33-45. doi: 10.4236/jcc.2016.415003.

Cited by

[1]	Analysis of hotspots and cooling strategy for multilayer three-dimensional integrated circuits
	2021

[2]	Runtime thermal management of many-core systems
	2019

[3]	Review local search algorithms in artificial intelligence
	International Academic Institute for Science and Technology, 2018

[4]	The Thermal-Constrained Real-Time Systems Design on Multi-Core Platforms--An Analytical Approach
	2018

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