Air Cooling of Mini-Channel Heat Sink in Electronic Devices - Journal of Electronics Cooling and Thermal Control

JECTC > Vol.3 No.2, June 2013

Journal of Electronics Cooling and Thermal Control

Volume 3, Issue 2 (June 2013)

ISSN Print: 2162-6162 ISSN Online: 2162-6170

Google-based Impact Factor: 0.25 Citations

Air Cooling of Mini-Channel Heat Sink in Electronic Devices ()

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Download as PDF (Size: 390KB) PP. 49-57

DOI: 10.4236/jectc.2013.32007 7,943 Downloads 14,970 Views Citations

Author(s)

Mousa M. Mohamed, Mostafa A. Abd El-Baky

Affiliation(s)

Mechanical Power Engineering Department, Faculty of Engineering, Minufiya University, Shebin El-Kom, Egypt.

ABSTRACT

Heat transfer experiments were conducted to investigate the thermal performance of air cooling through mini-channel heat sink with various configurations. Two types of channels have been used, one has a rectangular cross section area of 5 × 18 mm² and the other is triangular with dimension of 5 × 9 mm². Four channels of each configuration have been etched on copper block of 40 mm width,30 mm height, and 200 mm length. The measurements were performed in steady state with air flow rates of 0.002 - 0.005 m³/s, heating powers of 80 - 200 W and channel base temperatures of 48°C, 51°C, 55°C and 60°C. The results showed that the heat transfer to air stream is increased with increasing both of air mass flow rate and channel base temperature. The rectangular channels have better thermal performance than trian- gular ones at the same conditions. Analytical fin approach of 1-D and 2-D model were used to predict the heat transfer rate and outlet air temperature from channels heat sink. Theoretical results have been compared with experimental data. The predicted values for outlet air temperatures using the two models agree well with a deviation less than ±10%. But for the heat transfer data, the deviation is about +30% to –60% for 1-D model, and –5% to –80% for 2-D model. The global Nusselt number of the present experimental data is empirically correlated as

with accuracy of ±20% for

and compared with other literature correlations.

KEYWORDS

Mini-Channel Heat Sink; Channel Air Cooling; Electronic Cooling; Fin Approach

Share and Cite:

Mohamed, M. and El-Baky, M. (2013) Air Cooling of Mini-Channel Heat Sink in Electronic Devices. Journal of Electronics Cooling and Thermal Control, 3, 49-57. doi: 10.4236/jectc.2013.32007.

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