Circuits and Systems

Volume 3, Issue 3 (July 2012)

ISSN Print: 2153-1285   ISSN Online: 2153-1293

Google-based Impact Factor: 0.48  Citations  

High-Frequency Heating for Soldering in Electronics

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DOI: 10.4236/cs.2012.33033    5,114 Downloads   8,442 Views  Citations
Author(s)

ABSTRACT

Processes of high-frequency (HF) heating are examined and its parameters for the soldering of electronic modules are optimized. The advantages of HF heating are the following: selectivity by skin-effect; high density of energy; process- ing in any environment, including vacuum or inert gas; high ecological cleanliness, improvement solder flowing by electrodynamics forces increase the quality of soldering connections. Investigation of HF electromagnetic heating has allowed to optimize heating speed in local zones of soldering connections formation and to improve their quality due to joint action of superficial effects and electromagnetic forces.

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V. Lanin, "High-Frequency Heating for Soldering in Electronics," Circuits and Systems, Vol. 3 No. 3, 2012, pp. 238-241. doi: 10.4236/cs.2012.33033.

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