Author(s)

Momath Ndiaye¹, Goumbo Ndiaye², Madialène Sene¹

¹Fluid Mechanics and Applications Laboratory, Hydraulics, Rural Engineering, Machinery and Renewable Energies Department, Train-ing and Research Unit, Sine Saloum El Hadj Ibrahima NIASS University, Kaolack, Senegal.
²Civil Engineer Sen’eau, Dakar, Senegal.

The study of forced convection in a porous medium has aroused and still arouses today the interest of many scientists and industrialists. A considerable amount of work has been undertaken following the discovery of the phenomenon. Solving a standard problem of forced convection in porous media comes down to predicting the temperature and velocity fields as well as the intensity of the flow as a function of the various parameters of the problem. A numerical study of the condensation in forced convection of a pure and saturated vapor on a vertical wall covered with a porous material is presented. The transfers in the porous medium and the liquid film are described respectively by the Darcy-Brinkman model and the classical boundary layer equations. The dimensionless equations are solved by an implicit finite difference method and the iterative Gauss-Seidel method. Our study makes it possible to examine and highlight the role of parameters such as: the Froude number and the thickness of the porous layer on the speed and the temperature in the porous medium. Given the objective of our study, the presentation of velocity and temperature profiles is limited in the porous medium. The results show that the Froude number does not influence the thermal field. The temperature increases with an increase in the thickness of the dimensionless porous layer. The decrease in the Froude number leads to an increase in the hydrodynamic field.

Condensation, Implicit Finite Differences, Thin Film, Porous Material, Darcy-Brinkman Model, Vertical Wall

Ndiaye, M. , Ndiaye, G. and Sene, M. (2022) Numerical Study of Thin Film Condensation in Forced Convection of Saturated Vapor on a Vertical Wall Covered with a Porous Material. Journal of Electronics Cooling and Thermal Control, 11, 1-12. doi: 10.4236/jectc.2022.111001.