has been cited by the following article(s):
[1]
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Humidity and Electronics
2022
DOI:10.1016/B978-0-323-90853-5.00005-0
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[2]
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Thermal decomposition of solder flux activators under simulated wave soldering conditions
Soldering & Surface Mount Technology,
2017
DOI:10.1108/SSMT-01-2017-0003
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[3]
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Study of enhanced plastic ball grid array (EPBGA) package with heat spreader of copper plane
2015 16th International Conference on Electronic Packaging Technology (ICEPT),
2015
DOI:10.1109/ICEPT.2015.7236534
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