has been cited by the following article(s):
[1]
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Implementation of a Temperature Ramp Rate Requirement and Impact on the Packaging Processes
International Symposium on Microelectronics,
2018
DOI:10.4071/2380-4505-2018.1.000494
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[2]
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Progress in ultrasonic bonding wire process and quality evaluation of bonding point
AOPC 2017: Optical Sensing and Imaging Technology and Applications,
2017
DOI:10.1117/12.2285650
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[3]
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Thermal Analysis of Heating System in Thermosonic Bonding Process
Applied Mechanics and Materials,
2013
DOI:10.4028/www.scientific.net/AMM.300-301.794
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