Failure Analysis of Ceramic Substrates Used in High Power IGBT Modules

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ISSN Print: 1947-3931
ISSN Online: 1947-394X
www.scirp.org/journal/eng
E-mail: eng@scirp.org

"Failure Analysis of Ceramic Substrates Used in High Power IGBT Modules"
written by Zenjebil Jouini, Zarel Valdez-Nava, David Malec,
published by Engineering, Vol.8 No.9, 2016

has been cited by the following article(s):

[1]	Contribution à l'interconnexion de composants actifs intégrés dans des substrats laminés: apport des interfaces micro ou nano-structurées
	2020

[2]	Investigation of heat transfer and thermal stresses of novel thermal management system integrated with vapour chamber for IGBT power module
	2019

[3]	Effects of Particle Size of Al2O3 on the Mechanical Properties and Micro-Structures of Al2O3-3YSZ Composites
	2017

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