has been cited by the following article(s):
|
[1]
|
Use of nano structures for thermal mode of on-board appliances of space appliances
|
|
2019 |
|
|
|
|
[2]
|
ADVANCES IN NANOFLUIDICS RESEARCH
|
|
2017 |
|
|
|
|
[3]
|
Thermal Characterisation Analysis of Heat-Sink Heat Pipes under Forced Convection
|
|
Int. J. Mech. Eng. Autom,
2015 |
|
|
|
|
[4]
|
COMPUTER AIDED-THERMAL MODULE DESIGN
|
|
International Journal of Computer Research,
2014 |
|
|
|
|
[5]
|
U-and L-shaped heat pipes heat sinks for cooling electronic components employed a least square smoothing method
|
|
Microelectronics Reliability, Elsevier,
2014 |
|
|
|
|
[6]
|
Performance effects of heat transfer and geometry on heat pipe thermal modules under forced convection
|
|
?International Communications in Heat and Mass Transfer? ,
2014 |
|
|
|
|
[7]
|
L-and U-shaped heat pipes thermal modules with twin fans for cooling of electronic system under variable heat source areas
|
|
Heat and Mass Transfer, Springer,
2014 |
|
|
|
|
[8]
|
Study of Heat Transfer Process from a Circuit Board using Heat Pipes
|
|
2013 |
|
|
|
|
[9]
|
A fitting, simple and versatile window program (HSHPTM) design using lumped parameters and one-dimensional thermal resistance mo
|
|
Heat and Mass Transfer, Springer,
2013 |
|
|
|
|
[10]
|
HSHPTM program application in optimum of heat pipes thermal module
|
|
2012 |
|
|
|
|
[11]
|
Insert Molding Process Employing Vapour Chamber
|
|
Some Critical Issues for Injection Molding,
2012 |
|
|
|
|
[12]
|
Analyzing the pressure-difference phenomenon between the condensing and boiling sections in a heat pipe cooling system
|
|
International Communications in Heat and Mass Transfer? ,
2012 |
|
|
|
|
[13]
|
Air cooling module applications to consumer-electronic products
|
|
Heat Transfer-Engineering Applications,
2011 |
|
|
|
|
[1]
|
Use of nano structures for thermal mode of on-board appliances of space appliances
XLIII ACADEMIC SPACE CONFERENCE: dedicated to the memory of academician S.P. Korolev and other outstanding Russian scientists – Pioneers of space exploration,
2019
DOI:10.1063/1.5133176
|
|
|
|
|
[2]
|
U- and L-shaped heat pipes heat sinks for cooling electronic components employed a least square smoothing method
Microelectronics Reliability,
2014
DOI:10.1016/j.microrel.2014.02.034
|
|
|
|
|
[3]
|
L- and U-shaped heat pipes thermal modules with twin fans for cooling of electronic system under variable heat source areas
Heat and Mass Transfer,
2014
DOI:10.1007/s00231-014-1358-5
|
|
|
|
|
[4]
|
Performance effects of heat transfer and geometry on heat pipe thermal modules under forced convection
International Communications in Heat and Mass Transfer,
2014
DOI:10.1016/j.icheatmasstransfer.2014.07.023
|
|
|
|
|
[5]
|
A fitting, simple and versatile window program (HSHPTM) design using lumped parameters and one-dimensional thermal resistance models
Heat and Mass Transfer,
2013
DOI:10.1007/s00231-012-1061-3
|
|
|
|
|
[6]
|
Analyzing the pressure-difference phenomenon between the condensing and boiling sections in a heat pipe cooling system
International Communications in Heat and Mass Transfer,
2012
DOI:10.1016/j.icheatmasstransfer.2012.01.015
|
|
|
|
|
[7]
|
HSHPTM program application in optimum of heat pipes thermal module
2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
2012
DOI:10.1109/IMPACT.2012.6420248
|
|
|
|