has been cited by the following article(s):
|
[1]
|
Thermal Analytical Modelling of the Heat Transfer Through a Power PCB Dedicated to a High Current Density Modular Converter
|
|
PCIM Europe 2022; …,
2022 |
|
|
|
|
[2]
|
Méthodologie de dimensionnement d'un dissipateur thermique pour les convertisseurs de puissance
|
|
… de Thermique SFT …,
2022 |
|
|
|
|
[3]
|
Application and Verification of Effective Heat Spreading Angles on a Multi-Layer Thermal Design
|
|
2021 |
|
|
|
|
[4]
|
Thermal design for the package of high-power single-emitter laser diodes
|
|
2020 |
|
|
|
|
[5]
|
Three-dimensional thermal model of a high-power diode laser bar
|
|
Applied Optics,
2018 |
|
|
|
|
[6]
|
Heat Spreading Revisited–Effective Heat Spreading Angle
|
|
2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM),
2015 |
|
|
|
|
[7]
|
Non-Intrusive Case Temperature Measurement Method of Direct-Water-Cooled Power Module
|
|
ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels,
2015 |
|
|
|
|
[8]
|
Topological and Device Cost-Performance Optimization for 3-Phase Inverters in High Speed Electric Drive Systems
|
|
2014 |
|
|
|
|
[9]
|
Thermal management of a low-cost 2kW solar inverter
|
|
Power Electronics and Applications (EPE'14-ECCE Europe), 2014 16th European Conference,
2014 |
|
|
|
|
[1]
|
Chip Size Minimization for Wide and Ultrawide Bandgap Power Devices
IEEE Transactions on Electron Devices,
2023
DOI:10.1109/TED.2022.3232309
|
|
|
|
|
[2]
|
Thermal Circuit Models of Microstrip Lines Based on Precise Heat Spreading Angles and Convection Boundary Conditions
IEEE Transactions on Components, Packaging and Manufacturing Technology,
2023
DOI:10.1109/TCPMT.2023.3255870
|
|
|
|
|
[3]
|
Chip Size Minimization for Wide and Ultrawide Bandgap Power Devices
IEEE Transactions on Electron Devices,
2023
DOI:10.1109/TED.2022.3232309
|
|
|
|
|
[4]
|
Thermal design for the package of high-power single-emitter laser diodes
Optics & Laser Technology,
2020
DOI:10.1016/j.optlastec.2020.106266
|
|
|
|
|
[5]
|
Three-dimensional thermal model of a high-power diode laser bar
Applied Optics,
2018
DOI:10.1364/AO.57.009868
|
|
|
|
|
[6]
|
Heat spreading revisited – effective heat spreading angle
2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM),
2015
DOI:10.1109/SEMI-THERM.2015.7100145
|
|
|
|
|
[7]
|
Thermal management of a low-cost 2kW solar inverter
2014 16th European Conference on Power Electronics and Applications,
2014
DOI:10.1109/EPE.2014.6911026
|
|
|
|