Optics and Photonics Journal

Optics and Photonics Journal

ISSN Print: 2160-8881
ISSN Online: 2160-889X
www.scirp.org/journal/opj
E-mail: opj@scirp.org
"The Effect of Laser Sintering Process Parameters on Cu Nanoparticle Ink in Room Conditions"
written by Eerik Halonen, Esa Heinonen, Matti Mäntysalo,
published by Optics and Photonics Journal, Vol.3 No.4A, 2013
has been cited by the following article(s):
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[6] Fabrication of Cu Wiring Touch Sensor via Laser Sintering of Cu Nano/Microparticle Paste on 3D‐printed Substrate
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[7] Copper Micro and Nano Particles Mixture for 3D Interconnection Application
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[8] Understanding the sintering and heat dissipation behaviours of Cu nanoparticles during low-temperature selective laser sintering process on flexible substrates
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[9] Direct Writing of Cu Patterns on Polydimethylsiloxane Substrates Using Femtosecond Laser Pulse-Induced Reduction of Glyoxylic Acid Copper Complex
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[10] Laser-Induced Forward Transfer Towards Additive Manufacturing
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[11] Copper micro-electrode fabrication using laser printing and laser sintering processes for on-chip antennas on flexible integrated circuits
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[12] Intense pulse light sintering of an Ag microparticle-based, highly stretchable, and conductive electrode
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[13] The rise of conductive copper inks: challenges and perspectives
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[14] Thermal, electrical and mechanical characterization of microwave sintered Copper/carbon nanotubes (CNT) composites against sintering duration, CNT diameter and …
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[15] Selective Laser Sintering of Laser Printed Ag Nanoparticle Micropatterns at High Repetition Rates
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[16] Highly stretchable and conductive conductors based on Ag flakes and polyester composites
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[17] 基于原位体积加成制备导电线路的研究
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[18] Investigation of Different Sintering Methods on Ink-Jet-Printed Conductive Structures
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[19] Laser-Assisted Reduction of Highly Conductive Circuits Based on Copper Nitrate for Flexible Printed Sensors
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[20] Homogeneous Surface Profiles of Inkjet-Printed Silver Nanoparticle Films by Regulating Their Drying Microenvironment
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[21] EVALUATION OF COMMERCIALLY AVAILABLE SILVER INKS SCREEN PRINTED ON A PPE BASED SUBSTRATE
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[22] Laser Assist Reduction of Highly Conductive Circuits based on Copper Nitrate for Flexible Printed Sensors
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[23] Sintering Methods of Inkjet-Printed Silver Nanoparticle Layers
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[24] Charakterisierung von mechanischen und elektrischen Eigenschaften funktionaler Inkjet-gedruckter Strukturen
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[25] All-photonic drying and sintering process via flash white light combined with deep-UV and near-infrared irradiation for highly conductive copper nano-ink
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[26] A benchmark study of commercially available copper nanoparticle inks for application in organic electronic devices
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[27] Characterisation of Copper Nanoparticle Ink Printed FSS for Cellular Signals Suppression
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[28] Laser curing of inkjet printed strain gauge structures
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[29] Design & Material Characterization for 3D Printing Sensor
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[30] Investigation of Nanopowder Laser Sintering for Additive Manufacturing of Thermoelectric Devices
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[31] Method for producing a copper layer on a semiconductor body using a printing process
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[33] Comparison of Sintering Methods and Conductive Adhesives for Interconnections in Inkjet-Printed Flexible Electronics
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[34] Comparison of laser and intense pulsed light sintering (IPL) for inkjet-printed copper nanoparticle layers
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[35] Flash light sintered copper precursor/nanoparticle pattern with high electrical conductivity and low porosity for printed electronics
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[36] Nanoalloy Printed and Pulse-Laser Sintered Flexible Sensor Devices with Enhanced Stability and Materials Compatibility
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[37] Laser sintering for nano-manufacturing flexible circuitry
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[39] Highly conductive copper nano/microparticles ink via flash light sintering for printed electronics
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[40] Inkjet printed nano-particle Cu process for fabrication of re-distribution layers on silicon wafer
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[41] Characterization of Laser Sintering of Copper Nanoparticle Ink by FEM and Experimental Testing
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[42] Electrical property of laser-sintered nanopastes with reduced metal nanoparticles prepared by laser ablation in liquids
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