Circuits and Systems

Circuits and Systems

ISSN Print: 2153-1285
ISSN Online: 2153-1293
www.scirp.org/journal/cs
E-mail: cs@scirp.org
"High-Frequency Heating for Soldering in Electronics"
written by Vladimir L. Lanin,
published by Circuits and Systems, Vol.3 No.3, 2012
has been cited by the following article(s):
  • Google Scholar
  • CrossRef
[1] Algorithmic and Software Support for Technological Decision-Making in the Process of Induction Soldering
2020
[2] Improving the Efficiency of Induction Heating in the Air Gap of the Magnetic Circuit
2020
[3] Effects of Induction Heating in Air Gap of Magnetic Wire
2020
[4] Технология герметизации корпусов СВЧ микроблоков высокочастотной пайкой
2018
[5] Sizing up the Efficiency of Induction Heating Systems for Soldering Electronic Modules
Surface Engineering and Applied Electrochemistry, 2018
[6] Герметизация пайкой корпусов микроблоков из диамагнитных сплавов
2018
[7] ПОДГОТОВКА И ЭЛЕКТРОСТАТИЧЕСКАЯ СЕПАРАЦИЯ ПРИ РЕЦИКЛИНГЕ ЭЛЕКТРОННОГО ЛОМА
2018
[8] Investigation of Electrodynamic Forces in a Flat Induction System
2018
[9] Высокочастотный нагрев для герметизации пайкой корпусов СВЧ микроблоков
2018
[10] Application of Concentrated Electromagnetic Energy Streams in Electronics Manufacturing
2018
[11] Герметизация пайкой корпусов микроблоков из диамагнитных сплавов с применением высокочастотного нагрева
2018
[12] Исследование вещественного состава электронного лома и путей интенсификации его раскрытия при дезинтеграции
2017
[13] Оценка эффективности систем индукционного нагрева для пайки электронных модулей
2017
[14] The application of the concentrated electromagnetic energy streams in electronics manufacturing
2017
[15] Failure analysis for poor vertical fill of ENIG holes
2016
[16] Индукционный нагрев шариковых выводов припоя для монтажа корпусов BGA
2015
[17] Induction heating of solder ball leads for assembly of BGA packages
Surface Engineering and Applied Electrochemistry, 2015
[18] The hardware-software complex of electronic-optical system control
2014
[19] The study of temperature profiles with minicomputer
2014
[20] BGA Solder Balls Formation by Induction Heating
Article Author (s) page, 2014
[21] How Induction Soldering Improves the Process and Quality of Coax and Interconnect Assembly
D Marvin - itherm.com, 2014
[22] SOLDERING CONNECTIONS FORMATION AT INFLUENCE OF ENERGY OF ELECTROMAGNETIC FIELDS IN WIDE FREQUENCY BAND
International Journal of Engineering Science and Technology?, 2012
[23] Температурно-временные профили пайки электронных модулей
2012
SCIRP Newsletter
Copyright © 2006-2026 Scientific Research Publishing Inc. All Rights Reserved.
Top