Simplified Model of a Layer of Interconnects under a Spiral Inductor

HTML  XML Download Download as PDF (Size: 311KB)  PP. 187-190  
DOI: 10.4236/jemaa.2011.36031    7,381 Downloads   11,986 Views  Citations

Affiliation(s)

.

ABSTRACT

An empirical effective medium approximation that provides a homogeneous equivalent for a layer of interconnects un-derneath a spiral inductor is presented. When used as part of a numerical 3D model of the inductor, this approach yields a faster simulation that uses less memory, yet still predicts the quality factor and inductance to within 1%. We expect this technique to find use in the electromagnetic modeling of System-on-Chip.

Share and Cite:

S. Holik and T. Drysdale, "Simplified Model of a Layer of Interconnects under a Spiral Inductor," Journal of Electromagnetic Analysis and Applications, Vol. 3 No. 6, 2011, pp. 187-190. doi: 10.4236/jemaa.2011.36031.

Copyright © 2024 by authors and Scientific Research Publishing Inc.

Creative Commons License

This work and the related PDF file are licensed under a Creative Commons Attribution 4.0 International License.