World Journal of Nano Science and Engineering

World Journal of Nano Science and Engineering

ISSN Print: 2161-4954
ISSN Online: 2161-4962
www.scirp.org/journal/wjnse
E-mail: wjnse@scirp.org

Call For Papers

Special Issue on Nanocomposites

 

Nanocomposites are multiphase solid materials where one of the phases has one, two or three dimensions of less than 100 nanometers, or structures having nano-scale repeat distances between the different phases that make up the material. Nanocomposites differ from conventional composite materials due to the nanoscale dimensions of the filler phase and the exceptionally high surface to volume ratio of this phase. As a result they often perform unique mechanical, thermal, catalytic, optical or electrical properties which are controlled by factors such as local chemistry, crystallinity, morphology, or mobility.

 

In this special issue, we intend to invite front-line researchers and authors to submit original research and review articles on exploring Nanocomposites. Potential topics include, but are not limited to:


  • Polymer nanocomposite
  • Ceramic nanocomposites
  • Metal nanocomposites
  • Nano-engineered composites
  • Modeling of nanocomposite materials
  • Nanoparticle functionalization
  • Nanocomposite synthesis, structure, and properties
  • Nanocomposite processing, characterization, and applications


 

Authors should read over the journal’s For Authors carefully before submission. Prospective authors should submit an electronic copy of their complete manuscript through the journal’s Paper Submission System.

 

Please kindly specify the “Special Issue” under your manuscript title. The research field “Special Issue - Nanocomposites” should be selected during your submission.

 

Special Issue Timetable:

Submission Deadline

April 15th, 2016

Publication Date

June 2016

 

Guest Editor:

 

 

For further questions or inquiries, please contact Editorial Assistant at

wjnse@scirp.org.

Free SCIRP Newsletters
Copyright © 2006-2024 Scientific Research Publishing Inc. All Rights Reserved.
Top