Mechanical Properties of Micro- and Nanostructured Copper Films

N. Kosarev, M. Khazin, R. Apakashev, N. Valiev

The Ural State Mining University, Ekaterinburg, Russia.

DOI: 10.4236/msce.2013.15002                

Abstract

Mechanical properties of electrodeposited and electroless copper with nano- and crystalline structure are considered. Grain diameters in films ranged from 0.06 to 8 μm. A model is described which takes into account the grain boundary hardening and density of dislocation.

Keywords

Nano- and Microcrystalline Materials; Hall-Petch Relation; Yield Point Stress; Grain Boundary Hardening Coefficient; Nonequilibrium Grain Boundaries

Conflicts of Interest

The authors declare no conflicts of interest.

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