Microstructure Evolution of W-Cu Alloy Wire

Fei Shao, Wenge Chen, Hui Zhang, Bingjun Ding

School of Materials Science and Engineering, Xi’an University of Technology, Xi’an, China.
School of Science, Xi’an Jiaotong University, Xi’an, China.

DOI: 10.4236/msa.2012.33024                

Abstract

Microstructure of W-Cu alloy wire before and after hot-swaging was studied in this paper. Results show that a homogeneous microstructure of the W-Cu alloy wire was formed after hot-swaging treatment, and the tungsten particles were embedded in copper phases to form a networking structure; the W-Cu alloy wire has a microstructure of body-centered-cubic tungsten particles and face-centered-cubic copper phase, and did not change after hot-swaging. The intermediate phases have not been found during the process, but the size of the tungsten particles in the copper matrix becomes smaller. After hot-swaging, the treated W-Cu alloy wire has a relative density of 105.1%, and a conductivity of 47.2% IACS, the tensile and bending strength can be as large as 644 and 1600 MPa, respectively.

Keywords

Hot-Swaging; Microstructure; W-Cu Alloy; Wire

Conflicts of Interest

The authors declare no conflicts of interest.

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