Thermal Modeling of Thermosyphon Integrated Heat Sink for CPU Cooling

A. Shanmuga Sundaram, Anirudh Bhaskaran

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DOI: 10.4236/jectc.2011.12002                

Abstract

A thermal model has been developed to study the thermal behavior of Thermosyphon integrated Heat Sink during CPU cooling. An Indirect cooling module has been experimentally studied and analyzed under steady state condition for both natural and forced convection. The thermal model is employed to determine the actual heat transfer and the effectiveness of the present model and compared it with the conventional cooling method and found that there is an appreciable improvement in the present model.

Keywords

Thermosyphon, Heat Sink, Effectiveness, Conventional Cooling Method

Conflicts of Interest

The authors declare no conflicts of interest.

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