[1]
|
P. Enoksson, G. Stemme and E. Stemme, “A Silicon Resonant Sensor Structure for Coriolis Mass-Flow Measurements,” Journal of MEMS, Vol. 6, 1997, pp. 119-125.
http://dx.doi.org/10.1109/84.585789
|
[2]
|
R. Smith, D. Sparks, D. Riley and N. Najafi, “A MEMS-Based Coriolis Mass Flow Sensor for Industrial Applications,” IEEE Transactions on Industrial Electronics, Vol. 56, No. 4, 2009, pp. 1066-1071.
http://dx.doi.org/10.1109/TIE.2008.926703
|
[3]
|
H. Toda and T. Kobayakawa, “High-Speed Gas Concentration Measurement Using Ultrasound,” Sensors and Actuators A, Vol. 144, 2008, pp. 1-6.
http://dx.doi.org/10.1016/j.sna.2007.12.025
|
[4]
|
D. Sparks R. Smith, J. Patel and N. Najafi, “A MEMS-Based Low Pressure, Light Gas Density and Binary Concentration Sensor,” Sensors & Actuators A, Vol. 171, 2011, pp. 159-162.
http://dx.doi.org/10.1016/j.sna.2011.08.011
|
[5]
|
J. Gragg, “Silicon Pressure Sensor,” US Patent 4317126, 1982.
|
[6]
|
H. Henmi, S. Shoji, Y. Shoji, K. Yoshimi and M. Esashi, “Vacuum Packaging for Microsensors by Glass-Silicon Anodic Bonding,” Sensors and Actuators A, Vol. 43, 1994, pp. 243-250.
http://dx.doi.org/10.1016/0924-4247(94)80003-0
|
[7]
|
H. Elgamel, “Closed-Form Expressions for the Relationships between Stress, Diaphragm Deflection, and Resistance Change with Pressure in Silicon Piezoresistive Pressure Sensors,” Sensors and Actuators A, Vol. 50, 1995, pp. 17-12.
http://dx.doi.org/10.1016/0924-4247(95)01037-2
|
[8]
|
W. Baney, D. Chilcott, X. Huang, S. Long, J. Siekkinen, D. Sparks and S. Staller, “A Comparison between Micro-machined Piezoresistive and Capacitive Pressure Sensors, Proceedings of the Fall SAE Conference, 1997, pp. 61- 66.
|
[9]
|
B. Kim, R. Candler, R. Melamud, M. Hopcraft, S. Yoneoka, H. Lee, M. Agarwal, S. Chanorkar, G. Yama and T. Kenny, “Hermeticity and Diffusion Investigation in Poly-silicon Film Encapsulation for MEMS,” Journal of Applied Physics, Vol. 105, 2009, Article ID: 013514.
http://dx.doi.org/10.1063/1.3054366
|
[10]
|
D. Sparks, “The Hermeticity of Sealed Microstructures under Low Temperature Helium and Hydrogen Exposure,” Journal of Micromechanics and Microengineering, Vol. 23, 2013, Article ID: 015016.
http://dx.doi.org/10.1088/0960-1317/23/1/015016
|
[11]
|
D. Sparks, K. Kawaguchi, M. Yasuda, D. Riley, V. Cruz, N. Tran, A. Chimbayo and N. Najafi, “Embedded MEMS- Based Concentration Sensor for Fuel Cell and Biofuel Applications,” Sensors and Actuators A, Vol. 145-146, 2008, pp. 9-13.
http://dx.doi.org/10.1016/j.sna.2007.10.015
|
[12]
|
J. Mitchell, G. Lahiji and K. Najafi, “An Improved Performance Poly-Si Pirani Vacuum Gauge Using Heat-Distributed Structural Supports,” Journal of MEMS, Vol. 17, 2008, pp. 93-102.
http://dx.doi.org/10.1109/JMEMS.2007.912711
|
[13]
|
J. Mitchell and K. Najafi, “A Detailed Study of Yield and Reliability for Vacuum Packages Fabricated in a Wafer-Level Au-Si Eutectic Bonding Process,” Denver, Trans- ducers, 2009, Article ID: T2E.004.
|
[14]
|
D. Sparks, S. Massoud-Ansari and N. Najafi, “Long-Term Evaluation of Hermetically Glass Frit Sealed Silicon to Pyrex Wafers with Feedthroughs,” Journal of Microme- chanics and Microengineering, Vol. 15, 2005, pp. 1560-1564. http://dx.doi.org/10.1088/0960-1317/15/8/026
|
[15]
|
H. Cady and D. McFarland, “Helium in Natural Gas,” Science, Vol. 24, 1906, pp. 344-347.
http://dx.doi.org/10.1126/science.24.611.344
|
[16]
|
S. García-Blanco, P. Topart, Y. Desroches, J. Caron, F. Williamson, C. Alain and H. Jerominek, “Low Temperature Hermetic Wafer-Level Package for Uncooled Microbolometer FPAs,” Proceedings of SPIE 6884, 2008, Article ID: 68840P-1.
|
[17]
|
D. Sparks, G. Queen, R. Weston, G. Woodward, M. Putty, L. Jordan, S. Zarabadi and K. Jayakar, “Wafer-to-Wafer Bonding of Nonplanarized MEMS Surfaces Using Solder,” Journal of Micromechanics and Microengineering, Vol. 11, No. 6, 2011, pp. 630-634.
http://dx.doi.org/10.1088/0960-1317/11/6/303
|
[18]
|
J. Vinti, “The Dispersion and Absorption of Helium,” Physical Reviews, Vol. 42, 1932, pp. 632-640.
http://dx.doi.org/10.1103/PhysRev.42.632
|
[19]
|
R. Osiander and A. Darrin, “MEMS for Automotive and Aerospace Applications,” Woodhead Publishing, Oxford, 2013, p. 324.
|
[20]
|
Y. Tao and A. Malsha, “Theoretical Investigation on Hermeticity Testing of MEMS Packages Based on MIL-STD-883E,” Microelectronics and Reliability, Vol. 45, 2005, pp. 559-566.
http://dx.doi.org/10.1016/j.microrel.2004.08.004
|
[21]
|
T. Anthony, “Anodic Bonding of Imperfect Surfaces,” Journal of Applied Physics, Vol. 58, No. 5, 1983, pp. 2419-2424. http://dx.doi.org/10.1063/1.332357
|
[22]
|
Q.-Y. Tong and U. G?sele, “Semiconductor Wafer Bonding: Science and Technology,” Wiley Interscience, New York, 1999.
|
[23]
|
R. Swanson, “Electronic Pressure Transmitters: The Hydrogen Problem,” Sensors, Vol. 10, 1993, pp. 33-40.
|