Electrochemical Bioencapsulation of Nanomaterials into Collagen for Biomedical Applications

Abstract

Here we reported a novel electrochemical encapsulation method to encapsulate various nanomaterials and bimolecules into collagen. The electrochemical encapsulation process involves assembling of collagen along with Nano/bio materials using an isoelectric focusing mechanism. We have showed that a wide range of Nanomaterials such as carbon nanotubes, polymeric nanoparticles, magnetic calcium phosphate nanoparticles and biomolecules can be encapsulated into collagen. These novel collagen-based composite materials possess improved electric, mechanical, antimicrobial, magnetic, bioactive properties. Thus, this novel electrochemical encapsulation process offers a means to fabricate novel biomaterials for various biomedical applications such as tendon/ligament, nerve, skin tissue engineering, tendon/ligament to bone grafts, and sutures, etc.

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X. Cheng, V. Poenitzsch, L. Cornell, C. Tsao and T. Potter, "Electrochemical Bioencapsulation of Nanomaterials into Collagen for Biomedical Applications," Journal of Encapsulation and Adsorption Sciences, Vol. 3 No. 1, 2013, pp. 16-23. doi: 10.4236/jeas.2013.31003.

Conflicts of Interest

The authors declare no conflicts of interest.

References

[1] V. Ottani, M. Raspanti and A. Ruggeri, “Collagen Structure and Functional Implications,” Micron, Vol. 32, No. 3, 2001, pp. 251-260. doi:10.1016/S0968-4328(00)00042-1
[2] L. Cen, W. Liu, L. Cui, W. J. Zhang and Y. L. Cao, “Collagen Tissue Engineering: Development of Novel Biomaterials and Applications,” Pediatric Research, Vol. 63, No. 5, 2008, pp. 492-496. doi:10.1203/PDR.0b013e31816c5bc3
[3] O. Akkus, A. Panitch and X. G. Cheng, “Aligned Collagen and Method Therefor,” International Patent Application No. PCT/US2008/084958, 2009.
[4] X. G. Cheng, U. A. Gurkan, C. J. Dehen, M. P. Tate, H. W. Hillhouse, G. J. Simpson and O. Akkus, “An Electrochemical Fabrication Process for the Assembly of Anisotropically Oriented Collagen Bundles,” Biomaterials, Vol. 29, No. 22, 2008, pp. 3278-3288. doi:10.1016/j.biomaterials.2008.04.028
[5] X. G. Cheng and C. Tsao, “Delivery Substrates from Aligned Polymer Biomaterials for Tissue Repair,” US Patent No. 61/730261, 2012.
[6] X. G. Cheng and S. Desai, “Preparation of Nanoparticle Containing Aligned Collagen Fibers for Dense Connective Tissue Repair and Regeneration,” MRS Conference Proceedings, Cambridge Journals Online, Vol. 1417, 2012, p. 5.
[7] X. G. Cheng and V. Poenitzsch, “Aligned Polymers Including Bonded Substrates,” US Patent No. 12/813834, 2010.
[8] X. G. Cheng, Q. W. Ni and T. Potter, “Magnetic Calcium Phosphate Nanoparticles, Applications and Methods of Preparation Thereof,” US Patent No. 13/568644, 2012.
[9] X. G. Cheng, “Development of Amorphous Nanosilver-Chitosan-Collagen Biomaterial as an Antimicrobial Haemostatic Wound Healing Dressing,” Proceedings of 2011 MRS Fall Meeting, Boston, 2011.
[10] H. Kawasaki, K. Mizuseki, S. Nishikawa, S. Kaneko, Y. Kuwana, S. Nakanishi, S. I. Nishikawa and Y. Sasai, “Induction of Midbrain Dopaminergic Neurons from ES Cells by Stromal Cell-Derived Inducing Activity,” Neuron, Vol. 28, No. 1, 2000, pp. 31-40. doi:10.1016/S0896-6273(00)00083-0
[11] R. Zufferey, J. E. Donello, D. Trono and T. J. Hope, “Woodchuck Hepatitis Virus Posttranscriptional Regulatory Element Enhances Expression of Transgenes Delivered by Retroviral Vectors,” Journal of Virology, Vol. 73, No. 4, 1999, pp. 2886-2892.
[12] X. G. Cheng, A. Ben and J. Ling, “Electrochemical Aligned Collagen Sheet Cultured with Mesenchymal Stem Cells (MSCs) for Potential Skin Tissue Regeneration Applications,” Tissue Engineering and Regenerative Medicine (Termis) Conference, Houston, 18-21 December 2011, p. 14.
[13] P. J. Yang and J. S. Temenoff, “Engineering Orthopedic Tissue Interfaces,” Tissue Engineering—Part B: Reviews, Vol. 15, No. 2, 2009, pp. 127-141.
[14] H. H. Lu, S. D. Subramony, M. K. Boushell and X. Zhang, “Tissue Engineering Strategies for the Regeneration of Orthopedic Interfaces,” Annals of Biomedical Engineering, Vol. 38, No. 6, 2010, pp. 2142-2154. doi:10.1007/s10439-010-0046-y

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