Engineering

Vol.10 No.9(2018), Paper ID 87463, 10 pages

DOI:10.4236/eng.2018.109044

 

Thermal Decomposition of Printed Circuit Board in the Presence of Zinc Oxide under Inert and Oxidative Atmosphere: Emission Behavior of Inorganic Brominated Compounds

 

Osamu Terakado, Shunsuke Kuzuhara, Hironori Takagi, Masahiro Hirasawa

 

Department of Material and Environmental Engineering, National Institute of Technology, Hakodate College, Hakodate, Japan
Department of Materials and Environmental Engineering, National Institute of Technology, Sendai College, Natori, Japan
Department of Chemical Systems Engineering, Graduate School of Engineering, Nagoya University, Nagoya, Japan
Department of Chemical Systems Engineering, Graduate School of Engineering, Nagoya University, Nagoya, Japan

 

Copyright © 2018 Osamu Terakado, Shunsuke Kuzuhara, Hironori Takagi, Masahiro Hirasawa et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

 

How to Cite this Article


Terakado, O. , Kuzuhara, S. , Takagi, H. and Hirasawa, M. (2018) Thermal Decomposition of Printed Circuit Board in the Presence of Zinc Oxide under Inert and Oxidative Atmosphere: Emission Behavior of Inorganic Brominated Compounds. Engineering, 10, 606-615. doi: 10.4236/eng.2018.109044.

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