College of Physics and Electronic Information Engineer, Qinghai University for Nationalities, Qinghai, China
Chengdu Ganide Technology, Chengdu, China
College of Physics and Electronic Information Engineer, Qinghai University for Nationalities, Qinghai, China
Copyright © 2018 Qian Lin, Haifeng Wu, Guoqing Jia et al. This is
an open access article distributed under the Creative Commons Attribution
License, which permits unrestricted use, distribution, and reproduction in any
medium, provided the original work is properly cited.
How to Cite this Article
Lin, Q. , Wu, H. and Jia, G. (2018) Review of the Global Trend of Interconnect Reliability for Integrated Circuit.
Circuits and Systems,
9, 9-21. doi:
10.4236/cs.2018.92002.