Journal of Computer and Communications

Vol.4 No.15(2016), Paper ID 72310, 13 pages

DOI:10.4236/jcc.2016.415003

 

Thermal Simulation for Two-Phase Liquid Cooling 3D-ICs

 

Hong-Wen Chiou, Yu-Min Lee

 

Department of Electrical and Computer Engineering, National Chiao Tung University, Hsinchu, Chinese Taipei
Department of Electrical and Computer Engineering, National Chiao Tung University, Hsinchu, Chinese Taipei
Industrial Technology Research Institute, Hsinchu, Chinese Taipei

 

Copyright © 2016 Hong-Wen Chiou, Yu-Min Lee et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

 

How to Cite this Article


Chiou, H. and Lee, Y. (2016) Thermal Simulation for Two-Phase Liquid Cooling 3D-ICs. Journal of Computer and Communications, 4, 33-45. doi: 10.4236/jcc.2016.415003.

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