Journal of Electronics Cooling and Thermal Control

Vol.6 No.3(2016), Paper ID 70464, 7 pages

DOI:10.4236/jectc.2016.63011

 

Numerical Study of Conjugate Heat Transfer for Cooling the Circuit Board

 

Abdullah Alrashidi

 

Department of Mechanical Engineering, Northern Border University, Arar, Kingdom of Saudi Arabia

 

Copyright © 2016 Abdullah Alrashidi et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

 

How to Cite this Article

Alrashidi, A. (2016) Numerical Study of Conjugate Heat Transfer for Cooling the Circuit Board. Journal of Electronics Cooling and Thermal Control, 6, 120-126. doi: 10.4236/jectc.2016.63011.
Journals Menu
Follow SCIRP
Contact us
+1 323-425-8868
customer@scirp.org
WhatsApp +86 18163351462(WhatsApp)
Click here to send a message to me 1655362766
Paper Publishing WeChat

Copyright © 2024 by authors and Scientific Research Publishing Inc.

Creative Commons License

This work and the related PDF file are licensed under a Creative Commons Attribution 4.0 International License.