JSEMAT> Vol.1 No.2, July 2011

 

Copyright © 2011 Zhifeng Liu, Liuxian Zhao, Jun Zhong, Xinyu Li, Huanbo Cheng et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

 

How to Cite this Article

---

Liu, Z. , Zhao, L. , Zhong, J. , Li, X. and Cheng, H. (2011) Analysis of Mobile Phone Reliability Based on Active Disassembly Using Smart Materials. Journal of Surface Engineered Materials and Advanced Technology, 1, 80-87. doi: 10.4236/jsemat.2011.12012.

 

Download citation as EndNote