Journal of Surface Engineered Materials and Advanced Technology

Vol.5 No.4(2015), Paper ID 60335, 7 pages

DOI:10.4236/jsemat.2015.54022

 

Electrodeposition of Gold to Conformally Fill High-Aspect-Ratio Nanometric Silicon Grating Trenches: A Comparison of Pulsed and Direct Current Protocols

 

Sami Znati, Nicholas Chedid, Houxun Miao, Lei Chen, Eric E. Bennett, Han Wen

 

Imaging Physics Laboratory, Biochemistry and Biophysics Center, National Heart, Lung and Blood Institute, National Institutes of Health, Bethesda, MD, USA
Imaging Physics Laboratory, Biochemistry and Biophysics Center, National Heart, Lung and Blood Institute, National Institutes of Health, Bethesda, MD, USA
Imaging Physics Laboratory, Biochemistry and Biophysics Center, National Heart, Lung and Blood Institute, National Institutes of Health, Bethesda, MD, USA
Center for Nanoscale Science and Technology, National Institute of Standards and Technology, Gaithersburg, MD, USA
Imaging Physics Laboratory, Biochemistry and Biophysics Center, National Heart, Lung and Blood Institute, National Institutes of Health, Bethesda, MD, USA
Imaging Physics Laboratory, Biochemistry and Biophysics Center, National Heart, Lung and Blood Institute, National Institutes of Health, Bethesda, MD, USA

 

Copyright © 2015 Sami Znati, Nicholas Chedid, Houxun Miao, Lei Chen, Eric E. Bennett, Han Wen et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

 

How to Cite this Article


Znati, S. , Chedid, N. , Miao, H. , Chen, L. , Bennett, E. and Wen, H. (2015) Electrodeposition of Gold to Conformally Fill High-Aspect-Ratio Nanometric Silicon Grating Trenches: A Comparison of Pulsed and Direct Current Protocols. Journal of Surface Engineered Materials and Advanced Technology, 5, 207-213. doi: 10.4236/jsemat.2015.54022.

Copyright © 2026 by authors and Scientific Research Publishing Inc.

Creative Commons License

This work and the related PDF file are licensed under a Creative Commons Attribution 4.0 International License.