Department of Advanced Mechanical Systems, Kumamoto University, Kumamoto, Japan
Department of Advanced Mechanical Systems, Kumamoto University, Kumamoto, Japan
Department of Advanced Mechanical Systems, Kumamoto University, Kumamoto, Japan
Copyright © 2013 Yasushi Koito, Yoshihiro Kubo, Toshio Tomimura et al. This is
an open access article distributed under the Creative Commons Attribution
License, which permits unrestricted use, distribution, and reproduction in any
medium, provided the original work is properly cited.
How to Cite this Article
Koito, Y. , Kubo, Y. and Tomimura, T. (2013) Numerical Analysis of Printed Circuit Board with Thermal Vias: Heat Transfer Characteristics under Nonisothermal Boundary Conditions.
Journal of Electronics Cooling and Thermal Control,
3, 136-143. doi:
10.4236/jectc.2013.34015.