Electrical and Computer Engineering Department, Michigan Technological University, Houghton, USA
Electrical and Computer Engineering Department, Michigan Technological University, Houghton, USA
Electrical and Computer Engineering Department, Michigan Technological University, Houghton, USA
Copyright © 2013 Nicholas Riegel, Matthew Howard, Christopher Middlebrook et al. This is
an open access article distributed under the Creative Commons Attribution
License, which permits unrestricted use, distribution, and reproduction in any
medium, provided the original work is properly cited.
How to Cite this Article
N. Riegel, M. Howard and C. Middlebrook, "Optimal VIA Placement in Under Filled Embedded Multimode Waveguides,"
Optics and Photonics Journal, Vol. 3 No. 6, 2013, pp. 342-346. doi:
10.4236/opj.2013.36053.