Department of Mechanical Engineering, National Cheng-Kung University, Tainan
Department of Mechanical Engineering, National Cheng-Kung University, Tainan
Department of Civil Engineering, National Cheng-Kung University, Tainan
Copyright © 2013 C. F. Lin, G. H. Wu, S. H. Ju et al. This is
an open access article distributed under the Creative Commons Attribution
License, which permits unrestricted use, distribution, and reproduction in any
medium, provided the original work is properly cited.
How to Cite this Article
Lin, C. , Wu, G. and Ju, S. (2013) Investigation of Thermal Characterization of a Thermally Enhanced FC-PBGA Assembly.
Journal of Electronics Cooling and Thermal Control,
3, 85-93. doi:
10.4236/jectc.2013.33010.