Materials Sciences and Applications

Vol.3 No.7(2012), Paper ID 21166, 3 pages

DOI:10.4236/msa.2012.37069

 

Electrodeposition of Bi-Sb alloy using Cu electrodes

 

Masato Ohmukai, Akira Tsuyoshi

 

Department of Electrical and Computer Engineering, Akashi College of Technology, Akashi, Hyogo 674-8501, Japan
Department of Electrical Engineering, Kobe City College of Technology, Kobe, Hyogo 651-2194, Japan

 

Copyright © 2012 Masato Ohmukai, Akira Tsuyoshi et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

 

How to Cite this Article


M. Ohmukai and A. Tsuyoshi, "Electrodeposition of Bi-Sb alloy using Cu electrodes," Materials Sciences and Applications, Vol. 3 No. 7, 2012, pp. 492-494. doi: 10.4236/msa.2012.37069.

Copyright © 2024 by authors and Scientific Research Publishing Inc.

Creative Commons License

This work and the related PDF file are licensed under a Creative Commons Attribution 4.0 International License.