Materials Sciences and Applications
Vol.3 No.3(2012), Paper ID 18054, 8
pages
DOI:10.4236/msa.2012.33021
Through-Thickness Thermal Conductivity Prediction Study on Nanocomposites and Multiscale Composites
Michael Zimmer, Xinyu Fan, Jianwen Bao, Richard Liang, Ben Wang, Chuck Zhang, James Brooks
Florida State University, High-Performance Materials Institute, Tallahassee, USA
Florida State University, High-Performance Materials Institute, Tallahassee, USA
Florida State University, High-Performance Materials Institute, Tallahassee, USA
Florida State University, High-Performance Materials Institute, Tallahassee, USA
Florida State University, High-Performance Materials Institute, Tallahassee, USA
Florida State University, High-Performance Materials Institute, Tallahassee, USA
National High Fields Magnetic Laboratory, Tallahassee, USA
Copyright © 2012 Michael Zimmer, Xinyu Fan, Jianwen Bao, Richard Liang, Ben Wang, Chuck Zhang, James Brooks et al. This is
an open access article distributed under the Creative Commons Attribution
License, which permits unrestricted use, distribution, and reproduction in any
medium, provided the original work is properly cited.
How to Cite this Article
M. Zimmer, X. Fan, J. Bao, R. Liang, B. Wang, C. Zhang and J. Brooks, "Through-Thickness Thermal Conductivity Prediction Study on Nanocomposites and Multiscale Composites,"
Materials Sciences and Applications, Vol. 3 No. 3, 2012, pp. 131-138. doi:
10.4236/msa.2012.33021.