Vol. No.(), Paper ID 14106, 4 pages

DOI:

 

Fabrication of Inlay Structure Diamond Films on Cu Substrate and the Evaluation of Adhesion Strength

 

Wan-qi Qiu, Yan-xiang Zeng, Li-xian He, Zhong-wu Liu, De-chang Zeng, Xi-chun Zhong, Hong-ya Yu

 

School of Materials Science and Engineering,South China University of technology,Guangzhou,,P. R. China 510640
School of Materials Science and Engineering,South China University of technology,Guangzhou,,P. R. China 510640
School of Materials Science and Engineering,South China University of technology,Guangzhou,,P. R. China 510640
School of Materials Science and Engineering,South China University of technology,Guangzhou,,P. R. China 510640
School of Materials Science and Engineering,South China University of technology,Guangzhou,,P. R. China 510640
School of Materials Science and Engineering,South China University of technology,Guangzhou,,P. R. China 510640
School of Materials Science and Engineering,South China University of technology,Guangzhou,,P. R. China 510640

 

Copyright © Wan-qi Qiu, Yan-xiang Zeng, Li-xian He, Zhong-wu Liu, De-chang Zeng, Xi-chun Zhong, Hong-ya Yu et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

 

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