Vol. No.(), Paper ID 13540, 6 pages

DOI:

 

Processing Technologies of EVOH/Nano-SiO2 High-Barrier Packaging Composites

 

Yiwu Liu, Yuejun Liu, Shanshan Wei

 

Key Laboratory of New Materials and Technology for Packaging, Hunan University of Technology,Zhuzhou 412007, China
Key Laboratory of New Materials and Technology for Packaging, Hunan University of Technology,Zhuzhou 412007, China
Key Laboratory of New Materials and Technology for Packaging, Hunan University of Technology,Zhuzhou 412007, China

 

Copyright © Yiwu Liu, Yuejun Liu, Shanshan Wei et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

 

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