Influence of Substrate Bias Voltage on the Properties of Sputtered Aluminum-Scandium Thin Sheets

Journal of Surface Engineered Materials and Advanced Technology

ISSN Print: 2161-4881
ISSN Online: 2161-489X
www.scirp.org/journal/jsemat
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Citations

"Influence of Substrate Bias Voltage on the Properties of Sputtered Aluminum-Scandium Thin Sheets"
written by Julien Kovac, Heinz-Rolf Stock, Hans-Werner Zoch,
published by Journal of Surface Engineered Materials and Advanced Technology, Vol.2 No.2, 2012

has been cited by the following article(s):

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[1]	Progress in Optimization of Physical Vapor Deposition of Thin Films
	2021

[2]	Process chain for the fabrication of hardenable aluminium-zirconium micro-components by deep drawing
	5th International Conference on New Forming Technology (ICNFT 2018), 2018

[3]	The Effect of Interfacial Ge and RF-Bias on the Microstructure and Stress Evolution upon Annealing of Ag/AlN Multilayers
	2018

[4]	الارتباط بين عرض واجهة فلم–ركائز وقوة التصاق أفلام النحاس الرقيقة المغلفة لركائز الصلب الكربوني المصقولة بالأيونات عن طريق التغيير في الجهد كهربائي المتحيز …‎
	2017

[5]	Correlation between the Interface Width and the Adhesion Strength of Copper Films Deposited on Ion-Etched Carbon Steel Substrates by Varying the Bias Voltage
	2017

[6]	The rotating substrate holder of sputtering deposition for effective growth of thin copper films
	Science and Technology (TICST), 2015 International Conference on, 2015

[7]	Thickness Measurement of Aluminum Thin Film using Dispersion Characteristic of Surface Acoustic Wave
	IK Park, TS Park - s2is.org, 2014

[8]	Influence of the Process Parameters on the Properties of Sput-tered Aluminum-Zirconium Sheets
	Kovac, J., K?hler, B., Ramdani, Y., Henry, J., Stock, H. R., von Bargen, R., & Mehner, A., 2014

[9]	Correlation between the Interface Width and the Adhesion Strength of Copper Films Deposited on Ion-Etched Carbon Steel Substrates by Varying the Bias …
	A Ouis, K Touileb, R Djoudjou

[1]	Data-Driven Optimization of Manufacturing Processes Advances in Civil and Industrial Engineering, 2021 DOI:10.4018/978-1-7998-7206-1.ch015

[2]	Process chain for the fabrication of hardenable aluminium-zirconium micro-components by deep drawing MATEC Web of Conferences, 2018 DOI:10.1051/matecconf/201819015013

[3]	The Effect of Interfacial Ge and RF-Bias on the Microstructure and Stress Evolution upon Annealing of Ag/AlN Multilayers Applied Sciences, 2018 DOI:10.3390/app8122403

[4]	The rotating substrate holder of sputtering deposition for effective growth of thin copper films 2015 International Conference on Science and Technology (TICST), 2015 DOI:10.1109/TICST.2015.7369414

[5]	Thickness Measurement of Aluminum Thin Film using Dispersion Characteristic of Surface Acoustic Wave International Journal on Smart Sensing and Intelligent Systems, 2014 DOI:10.21307/ijssis-2019-049

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