Arrayed wave guide devices are the foundations of the next generation optical fiber communication technology development, which have bright and wide application prospects. These arrayed waveguide chips, similar in many ways to their electronic counterparts, are fabricated using wafer-level processing techniques and use optical waveguides to route photons, the same way that metal traces are used toroute electrons in an electronic chip. These devices include optical beam splitters/combiners for branching/ combining optical signals, optical switchers for changing optical paths, optical filtering for introducing multiple optical channels into a single optical fiber, and so on. These devices have many features, such ascompact structure, strong noise immunity, excellent property, and easy automation production, which are the developing frontiers of optoelectronic devices at present. Arrayed waveguide devices are rich in theirs categories and structures. With the rapid increasing demands for the quality devices of optical fiber communication system, many problems about mechanisms and rules of manufacturing process for arrayed waveguide devices packaging must be investigated more profoundly, in order to make a breakthrough in the manufacturing technologies, processes and equipment of arrayed wave guide devices.