Understanding of Ultrasonic Assisted Machining with Diamond Grinding Tool

Kyung-Hee Park, Yun-Hyuck Hong, Kyeong-Tae Kim, Seok-Woo Lee, Hon-Zong Choi, Young-Jae Choi

Korea Institute on Industrial Technology, Chungcheong Regional Division, Cheonan-si, South Korea.
Korea Institute on Industrial Technology, Future Manufacturing System R&D Group, Manufacturing System R&D Department, Cheonan-si, South Korea.
Korea Institute on Industrial Technology, IT Converged Process R&D Group, Convergent Technology R&D Department, Ansan-si, South Korea.

DOI: 10.4236/mme.2014.41001                

Abstract

In this work, machining test was carried out in various machining conditions using ultrasonic vibration capable CNC machine. For work material, alumina ceramic (Al₂O₃) was used while for tool material diamond electroplated grinding wheel was used. To evaluate ultrasonic vibration effect, grinding test was performed with and without ultrasonic vibration in same machining condition. In ultrasonic mode, ultrasonic vibration of 20 kHz was generated by HSK 63 ultrasonic actuator. On the other hand, grinding forces were measured by KISTLER dynamometer. And an optimal sampling rate for grinding force measurement was obtained by a signal processing and frequency analysis. The surface roughness of the ceramic was also measured by using stylus type surface roughness instrument and atomic force microscope (AFM). Besides, the scanning electron microscope (SEM) was used for observation of surface integrality.

Keywords

Ultrasonic Vibration; Grinding; Alumina Ceramic; Grinding Forces; Surface Roughness

Conflicts of Interest

The authors declare no conflicts of interest.

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