[1]
|
W. H. Chi, T. L. Chou, C. N. Han and K. N. Chiang, “Analysis of Thermal Performance of High Power Light Emitting Diodes Package,” International Conference on Electronics Packaging Technology, Nanjing, 2008, pp. 533-538.
|
[2]
|
X. Luo, W. Xiong and S. Liu, “A Simplified Thermal Resistance Network Model for High Power LED Street Lamp,” International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, 2008, pp. 1-7.
|
[3]
|
B. Li, “Lumen Efficiency of 1 W-Level High Power White LED,” Semiconductor Optoelectronics, Vol. 26, No. 4, 2005, pp. 314-316.
|
[4]
|
X. He, B. Cheng, L. Yin and J. Zhang, “Testing System for Thermal Resistance of High-Power LED,” Electronic Measuremient Technology, Vol. 31, No. 9, 2008, pp. 17-20.
|
[5]
|
N. Holonyak, “Is the Light Emitting Diode (LED) an Ultimate Lamp?” American Journal of Physics, Vol. 68, No. 9, 2000, pp. 864-868.
|
[6]
|
W. Dai, J. Wang and Y. Li, “Transient Thermal Analysis of High-power LED Package,” Semiconductor Optoelectronics, Vol. 29, No. 3, 2008, pp. 324-328.
|
[7]
|
B. Yu and Y. Wang, “Junction Temperature and Thermal Resistance Restrict the Developing of High-power LED,” Chinese Journal of Luminescence, Vol. 26, No. 6, 2005, pp. 761-766.
|
[8]
|
N. Narendran and Y. Gu, “Life of LED-Based White Light Source,” IEEE/OSA Journal of Display Technology, Vol. 1, No. 1, 2005, pp. 167-171.
|
[9]
|
X. Luo and S. Liu, “A Microjet Array Cooling System for Thermal Management of High-Brightness LEDs,” IEEE Transactions on Advanced Packaging, Vol. 30, No. 3, 2007, pp. 475-484.
|
[10]
|
K. Zhang, G. Xiao, C. Wong, H. Gu and B. Xu, “Study on Thermal Interface Material with Carbon Nanotubes and Carbon Black in High-Brightness LED Packaging with Flip-Chip Technology,” 55th Electronic Components and Technology Conference, Lake Buena Vista, 2005, pp. 60-65.
|
[11]
|
L. Yuan, S. Liu, M. Chen and X. Luo, “Thermal Analysis of High Power LED Array Packaging with Microchannel Cooler,” 7th International Conference on Electronic Packaging Technology (ICEPT '06), Shanghai, 2006, pp. 1-5.
|
[12]
|
Y. Liu, G. Fu, C. Gao, X. Li and S. Wang, “Thermal Analysis of Illumination High-Power LED,” Chinese Journal of Electron Devices, Vol. 31, No. 6, 2008, pp. 1716-1719.
|
[13]
|
S. Zhang, L. Fang, G. Fu, X. Tan, J. Dong, Y. Chen and L. Gao, “Effect of Thermal Conductive Coating on Thermolysis Property of LED,” Semiconductor Optoelectronics, Vol. 28, No. 6, 2007, pp. 793-796.
|