[1]
|
A. J. Blodgett, “A Multilayer Ceramic Multi-Chip Module,” IEEE Transaction on Components, Hybrids, and Manufacturing Technology, Vol. 3, No. 4, 1980, pp. 634637. doi:10.1109/TCHMT.1980.1135663
|
[2]
|
T. Takahashi and M. Takaya, “Laminated Electronics Parts and Process for Making the Same,” US Patent No. 4322698, 1982.
|
[3]
|
Y. Shimada, K. Utsumi, M. Suzuki, H. Takamizawa, M. Nitta and T. Watari, “Low Firing Temperature Multilayer Glass-Ceramic Substrate,” IEEE Transaction on Components, Hybrids, and Manufacturing Technology, Vol. 6, No. 4, 1983, pp. 382-388.doi:10.1109/TCHMT.1983.1136194
|
[4]
|
T. Tamura, A. Dohya and T. Inoue, “Combination of Thick-Film Dielectric/Thin Film Conductor for Fine Pattern Formation of Multilayer Substrate,” Electro Component Science and Technology, Vol. 8, No. 3-4, 1981, pp. 235-239. doi:10.1155/APEC.8.235
|
[5]
|
H. Mandai, K. Sugoh, K. Tsukamoto, H. Tani and M. Murata, “A Low Temperature Cofired Multilayer Ceramic Substrate Containing Copper Conductors,” Proceedings of the 4th International Microelectronics Conference, Kobe, 28-30 May 1986, pp. 61-64.
|
[6]
|
F. Uchikoba and K. Yamashita, “A New Fine Patterning Method for LTCC Electrode Used with Photo-Patterned Dry Film,” Proceedings of the International Conference on Electronics Packaging, Tokyo, 19-21 April 2006, pp. 376-380.
|
[7]
|
Y. Akagi, N. Ota, K. Urata and F. Uchikoba, “A Forming Method of Cavity Structure with LTCC Substrate Using Photo Resist Film,” Proceedings of International Conference on Electronics Packaging, Kyoto, 14-16 April 2009, pp. 734739.
|
[8]
|
L. Chen, C. His, S. Fu and J. Lin, “Cosintering of NiZn-Cu Ferrite with Low-Temperature Cofired Ceramic Substrate,” Japanese Journal of Applied Physics, Vol. 39, No. 1, 2000, pp.150-154. doi:10.1143/JJAP.39.150
|
[9]
|
J. Jao, P. Li and S. Wang, “Characterization of Inductor with Ni-Zn-Cu Ferrite Embedded in B2O3-SiO2 Glass,” Japanese Journal of Applied Physics, Vol. 46, No. 9, 2007, pp. 5792-5796. doi:10.1143/JJAP.46.5792
|