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http://dx.doi.org/10.1016/j.matdes.2014.03.022

has been cited by the following article:

• TITLE: Optimization of the Implementation Process and Physical Properties of Cotton ( Gossipium hirsutum ) and Kenaf ( Hibiscus cannabinus L.) Wooden Chipboard

  AUTHORS: Sagnaba Soulama, Kokou Esso Atcholi, Bétaboalé Naon, Komi Kadja, Komla Sanda

  KEYWORDS: Chipboard, Cotton Wood, Kenaf Wood, Bone Glue, Mechanical Properties

  JOURNAL NAME: Engineering, Vol.7 No.12, December 21, 2015

  ABSTRACT: The present study aims at valorizing two residues types of the foodless vegetable biomass which are abundant and very pollutant in Burkina Faso. To do it, first we try to identify the optimal values of chipboard elaboration parameters with kenaf and cotton stems by using a natural binder (the bone glue). Next we proceed to the elaboration of two panels types with optimized elaboration parameters. Besides we determine mechanical and thermal characteristics of elaborated panels with a view of an indoor thermal insulation application. Also it becomes necessary for us to determine by experimenting the thermal conductivity, Young’s modulus, Coulomb’s modulus, and the water inflation rate, taking into account some elaboration parameters on one hand and the correlation between mechanical and thermal properties on the other hand. Finally, the obtained results are compared with the panels properties values required by ANSI A 208.1-1999 standard.